Hardware Design
Complete hardware design — schematics, PCB layout, BOM and manufacturing documentation. We specialize in multilayer PCBs, high-frequency circuits, antenna design and optimization, and miniaturization.
Embedded Systems & IoT
We connect
the physical world
with digital
We develop hardware and software for embedded systems, specializing in wireless communication and low-power solutions powered by renewable energy sources.
What we do
Complete solutions
from design to production
We deliver full development from initial concept to manufacturing documentation and PCB assembly.
Firmware & Software
Firmware development for microcontrollers and embedded Linux systems. Implementation of communication protocols, RTOS applications, OTA updates and cloud connectivity.
Assembly & Manufacturing
We manage the complete manufacturing process — from selecting the assembly house, through BOM optimization, to quality control of finished products. Prototypes and series production.
Rapid prototyping
A working prototype quickly and in small quantities, including a custom enclosure made by 3D printing, CNC or sheet metal.
Learn moreParylene coating
The most effective protection of assembled boards against moisture, condensation, salt fog and chemicals.
Learn moreCybersecurity
Security built into the device design and consulting on obligations under RED, CRA, the Data Act and NIS2.
Learn moreWireless retrofit
We add a communication interface and wireless data transfer to older meters, control units and other equipment.
Learn moreNot sure where to start?
Tell us what you need to solve and we will suggest the right approach.
Write to usServices
Rapid prototyping
A working prototype quickly and in small quantities: from validating the idea on development kits through the first boards and proof-of-concept firmware to a finished device in a custom enclosure. We design enclosures and mechanical parts and arrange their manufacture. We choose the technology by purpose, quantity and budget.
Prototyping technologies
FDM 3D printing
PLA, PETG, ASA, TPU
- Properties
- Low cost and fast. Visible layers, lower accuracy.
- Best for
- First iterations, checking dimensions and assembly, jigs and fixtures.
SLA / DLP 3D printing
photopolymer resin
- Properties
- Fine detail and a smooth surface. More brittle material.
- Best for
- Appearance prototypes, small precise parts, samples for customers.
SLS / MJF 3D printing
nylon
- Properties
- Strong and tough parts without supports, matte surface.
- Best for
- Functional enclosures, snap fits and living hinges, small series without a mould.
PolyJet 3D printing
rigid and flexible photopolymers
- Properties
- Several materials and colours in one part, very fine detail.
- Best for
- Enclosures with soft buttons or seals, realistic appearance models.
Metal 3D printing (SLM / DMLS)
aluminium, stainless steel, titanium
- Properties
- Complex shapes that machining cannot make.
- Best for
- Heat sinks and brackets with complex shapes, small metal parts.
CNC milling and turning
aluminium, stainless steel, brass, plastics (POM, PC, PMMA)
- Properties
- High accuracy and strength, quality surface.
- Best for
- Aluminium enclosures with heat dissipation, precise mechanical parts, rugged field units.
Sheet metal parts
aluminium, stainless steel, steel, acrylic
- Properties
- Laser cutting and bending. Thin, strong and low-cost parts.
- Best for
- Front panels, covers, brackets and chassis.
Vacuum casting
polyurethanes with ABS-, PC-, PP- or rubber-like properties
- Properties
- Look and properties close to injection-moulded parts. A silicone mould makes tens of castings.
- Best for
- Small series for pilot deployments and customer tests.
Injection moulding with rapid tooling
ABS, PC, PC/ABS, POM, PP, nylon, TPU
- Properties
- Lowest cost per part. The mould is cheaper and faster than production tooling.
- Best for
- Hundreds to thousands of parts, transition to production.
Surface finishing
painting, anodizing, bead blasting, brushing
- Properties
- Final look, colours and a more durable surface.
- Best for
- Prototypes for presentations, trade fairs and pilot series.
Modified standard enclosures
industrial plastic and aluminium enclosures
- Properties
- Fast and low-cost, with a proven IP rating.
- Best for
- Industrial devices and small series where a standard look is fine.
Electronics protection
Parylene coating
Parylene C
The most effective protection of assembled boards against the environment. A very thin, continuous layer shields the electronics from moisture, condensation, salt fog and chemicals. We arrange the coating including board preparation and masking.
How it is applied
- VaporizationThe solid parylene dimer is turned into gas under vacuum.
- PyrolysisAt high temperature the gas splits into a reactive monomer.
- DepositionIn the chamber the monomer polymerizes on the board into a continuous film. The board stays at room temperature.
The process needs no solvents or curing, and the film penetrates under components and into narrow gaps.
Properties
- Thickness from a few to tens of micrometres, precisely controlled
- Continuous, pinhole-free film, also on edges and under components
- Excellent barrier against moisture and chemicals
- Electrical insulation with low losses, also at high frequencies
- Biocompatible, also used in medical devices
- Adds practically no weight or size, suitable for miniature devices
Keep in mind
- Connectors, contacts and test points are masked before coating.
- Reworking the board after coating is more difficult.
- In air, Parylene C withstands long-term temperatures up to about 80 °C.
Best forOutdoor sensors and trackers, wearable and medical electronics, devices exposed to condensation or salt fog.
Services
Cybersecurity
We build security into the device design: secure bootloader, encrypted communication with key management and signed OTA updates. We also offer consulting. We review your product, propose the necessary measures and help you comply with the regulations in the overview.
Regulations for connected devices
RED – cybersecurity
Regulation (EU) 2022/30
from 1 Aug 2025
- Who
- Manufacturers and importers of radio equipment that connects to the internet or processes personal data.
- What it requires
- Protection of the network, of personal data and against fraud as a condition for CE marking. Conformity can be shown with the EN 18031 standards.
Cyber Resilience Act (CRA)
Regulation (EU) 2024/2847
reporting from 11 Sep 2026, fully from 11 Dec 2027
- Who
- Manufacturers, importers and distributors of products with digital elements, i.e. almost every device with firmware and connectivity.
- What it requires
- Security for the whole support period: vulnerability handling, security updates, documentation and CE marking. Actively exploited vulnerabilities must be reported.
Data Act
Regulation (EU) 2023/2854
for products placed on the market after 12 Sep 2026
- Who
- Manufacturers of connected (IoT) products and providers of related services.
- What it requires
- Users must have easy and secure access to the data the device generates. The product design must make this possible.
NIS2
In CZ: Act No. 264/2025 Coll.
from 1 Nov 2025
- Who
- Medium and large organisations in selected sectors such as energy, manufacturing, transport or healthcare, and indirectly their suppliers.
- What it requires
- Cybersecurity risk management, incident reporting and supply chain security.
An indicative overview. It does not replace a legal assessment of a specific product.
Technologies
Embedded technologies
without compromise
From miniaturized wireless device design through low-power communication to energy autonomy — we cover the full spectrum of technologies for modern embedded systems.
Short-Range Communication
BLE, Zigbee/Thread, Wi-Fi and proprietary solutions for IoT, wearables and smart home.
Long-Range LPWAN
LoRa, LoRaWAN and 433/868/915 MHz ISM bands for wireless sensors, remote controls and IoT ecosystems.
Cellular IoT
LTE, LTE-M, NB-IoT and 5G NR — from low-power sensors to high-speed industrial applications.
Satellite & GNSS
Satellite LTE, NTN (Non-Terrestrial Networks) and GNSS for positioning, asset tracking and communication beyond terrestrial coverage.
Energy Harvesting
Design of low-power embedded systems powered by renewable sources — solar panels, piezoelectric converters, thermal and RF energy harvesting. Minimal consumption, maximum autonomy.
Device Miniaturization
High-density HDI PCBs, BGA and CSP packaging, embedded passive components and advanced design techniques for extremely compact devices — from miniature sensors to wearable electronics.
How we work
From idea
to finished product
Analysis & Specification
Together we define technical requirements, select suitable technologies and create a detailed project specification including cost estimates and timeline.
HW Design & Simulation
Schematic design, component selection and PCB layout with emphasis on RF properties, power consumption and manufacturability. Simulation of key analog circuits.
Firmware & Prototype
Prototype PCB fabrication and firmware development. Iterative tuning of hardware and software, verification of RF parameters and power consumption in real conditions.
Testing & Certification
Comprehensive testing of functionality, reliability and RF parameters. Preparation of documentation for regulatory certification (CE, RED, FCC and others per target market).
Manufacturing Docs & Production
Preparation of complete manufacturing documentation (Gerber, BOM, pick & place files) and coordination of PCB assembly with a trusted manufacturing partner.
Our Work
Miniature tracker
for wildlife monitoring
A showcase of extremely compact device design — from schematics and PCB layout through component selection to final visualization.
Key Specifications
- Weight from 2.8 g (with battery and solar panel)
- Miniaturized enclosure optimized for avian wearability
- PCB dimensions: 18.43 × 11.53 mm
- Miniature 4-layer HDI PCB with high interconnect density
- LTE-M / NB-IoT + GNSS
- Global cellular connectivity with precise satellite positioning
- IMU unit (acc + gyro + temperature)
- 3-axis accelerometer, gyroscope and temperature sensor for behavioral analysis
- Energy harvesting + MPPT
- Miniature GaAs solar panel with MPPT Li-Ion / LiPo battery charger
- 64 Mbit FLASH + precision RTC
- Ample storage for offline data logging with accurate timestamping
- Outdoor-ready design
- Weather-resistant, operating temperature range −40 to +85 °C
About
Technology with passion
and experience
20+ years of industry experience
Montyho technology s.r.o. is a Czech company specializing in embedded systems development. We combine deep electronics knowledge with modern software approaches to create innovative custom products.
Our strength is the ability to design complete solutions — from MCU and RF chip selection, through PCB layout to firmware and cloud backend. We place special emphasis on power optimization and wireless communication reliability in demanding conditions.
- Complete HW and SW development under one roof
- Specialization in RF design and wireless protocols
- Experience with ultra-low power and energy harvesting
- From prototype to series production
- Maximum miniaturization — multilayer PCB, BGA, CSP and embedded components
- Outdoor and industrial designs for −40 to +85 °C, IP67+ and high vibration
Contact
Tell us what you need to solve
A few sentences about your plan are enough. We will get back to you with questions or a suggestion on how to proceed.
Email
tomas.urbanek@montyho.com
Phone
+420 602 681 051
Location
Jasanová 187, 277 14 Dřísy, Czech Republic
Company
Montyho technology s.r.o.
Company ID 24230731 · VAT CZ24230731